Fully ion implanted junction field effect transistor

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156643, 156645, 357 15, 357 67, H01L 2980, H01L 2964

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active

H00002917

ABSTRACT:
A method of making a planar junction field-effect transistor in which a semi-insulating substrate of a III-V semiconductor, particularly InP, is ion implanted by two ions to produce both an n-type region and a p-type region. The gate is further defined by selectively etching through the gate-implant region to the source/drain channel.

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patent: 4471367 (1984-09-01), Chen
J. B. Boos et al., Fully Implanted InP Junction FET's, IEEE Electron Device etters, vol. EDL-3, pp. 256-258, 1982.
K. J. Sleger et al., Low Noise Ion Implanted InP FET's IEEE Transactions of Electron Devices, vol. ED-28, pp. 1031-1034, 1981.
R. Yeats et al., Research on InGaAs FETs., Final Report on Contract N00014-78-C-0380 AD-A108016, 1981.
Applied Physics Letters, vol. 34, Feb. 1979 by Armiento, pp. 229-231.

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