Fully-depleted SOI device

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S344000, C257S408000

Reexamination Certificate

active

06876037

ABSTRACT:
The present invention is generally directed to a fully-depleted SOI device structure. In one illustrative embodiment, the device comprises first, second and third doped regions formed in the bulk substrate, wherein the dopant concentration level in the doped regions is greater than the dopant concentration in the bulk substrate. The first doped region is substantially aligned with the gate electrode of the device, while the second and third doped regions are vertically spaced apart from the first doped region.

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Baine et al., “Back Gate Effects in N-Channel Monocrystalline Silicon Devices-on-Glass and Their Suppression by Boron Ion Implantation,”Mat. Res. Soc. Symp. Proc., 558:369-74, 2000.
Chang et al., “Efficacy of Air in Reducing the Kink Effect on Floating-Body NFD/SOI CMOS,”Proc. 1998 IEEE Int'l SOI Conf., pp. 155-156, 1998.
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Leung et al., “High voltage, high speed lateral IGBT in thin SOI for power IC,”SOI 1996 Int'l Conference Proceedings, pp. 132-133, 1996.

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