Fully additive method of applying a circuit pattern to a three-d

Details Fully additive method of applying a circuit pattern to a three-d Fully additive method of applying a circuit pattern to a three-d

1997-01-16

1998-11-17

Bowers, Jr., Charles L.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

H01L 2144

Patent

active

058376097

ABSTRACT:
A fully additive method of applying a circuit pattern to a three-dimensional, nonconductive part comprises: pretreating the surface of the part; pad-printing a surface catalyst in a solvent carrier onto the surface in the shape of a desired circuit pattern; and applying an electroless copper deposit onto the surface catalyst, thereby providing a copper layer on the surface in the desired circuit pattern shape.

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"Praktische Systemlosungen im Tampondruck: Advanced system solutions in pad printing", Product Technical Brochure, TAMPOflex GmbH, Boschstrasse 5, D71254 Ditzingen, 07156/937010, 4 pgs.
"Original TAMPOPRINT Spezialmaschinenbau Leads Worldwide", Product Technical Brochure, by TAMPOPRINT Firmengruppe, Lingwiesenstr. 1, 70 825 Korntal-Munchingen, 071 50/928-0, 18 pgs.

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