Full wafer integrated circuit testing device

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

324158F, G01R 3102

Patent

active

050702971

ABSTRACT:
A full wafer integrated circuit testing device (10) tests integrated circuits (15) formed as a wafer in conjunction with a test control unit (40). Probe units (14) associate with respective integrated circuits (15). Probe tips (16) on probe units (14) communicate with respective pads (19) with the integrated circuits (15). Interface circuitry (36) selectively communicates test data between the test control unit (40) and the integrated circuit (15). Test pins (16) have positions on probe units (14) associated with respective integrated circuit connection points (19) for testing associated integrated circuit (15) components. Interface circuitry (36) includes comparators (54 and 56) that compare signals between the integrated circuit (15) and the test control unit (40). Memory components (66 and 68) store data associated with signals from test control unit (40) and said integrated circuit (15). Compliant material (32) assures that probe tips (16) throughout probe card (10) positively and conductively engage integrated circuit pads (19) of all associated integrated circuits (15) of a wafer.

REFERENCES:
patent: 4038599 (1977-07-01), Bove et al.
patent: 4520314 (1985-05-01), Asch et al.
patent: 4799009 (1989-01-01), Tada et al.
patent: 4928278 (1990-05-01), Otsuji et al.
patent: 4961052 (1990-10-01), Tada et al.
patent: 4965865 (1990-10-01), Trenary
"Membrane Probe Card Technology (The Future For High Performance Wafer Test)", by Leslie et al., 1988 International Test Conference, 1988 IEEE, Paper 30.1, pp. 601-607.
"Very High Density Probing", by Barsotti et al., 1988 International Test Conference, 1988 IEEE, Paper 30.2, pp. 608-614.
"A Single-Chip LSI High-Speed Functional Tester", by Miyamoto et al., IEEE Journal of Solid-State Circuits, vol. SC-22, No. 5, Oct. 1987, pp. 820-828.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Full wafer integrated circuit testing device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Full wafer integrated circuit testing device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Full wafer integrated circuit testing device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1698547

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.