Front opening unified pod

Details Front opening unified pod Front opening unified pod

2005-05-31

2005-05-31

Maust, Timothy L. (Department: 3751)

Fluent material handling, with receiver or receiver coacting mea

Processes

With material treatment

C141S008000, C141S065000, C141S069000, C141S085000, C141S089000, C141S091000

Reexamination Certificate

active

06899145

ABSTRACT:
A front opening unified pod (FOUP) used for temporarily and portably storing semiconductor wafers between processing steps includes a manifold for uniformly distributing a purge gas in the FOUP during a purging process between wafer processing steps. The manifold can be a variety of shapes, and can be located in a number of appropriate locations within the FOUP. The manifold generally extends the full height of the FOUP and includes a plurality of openings configured to direct a flow of purge gas above and below each wafer held by the FOUP.

REFERENCES:
patent: 4745088 (1988-05-01), Inoue et al.
patent: 5879458 (1999-03-01), Roberson et al.
patent: 5988233 (1999-11-01), Fosnight et al.
patent: 6364922 (2002-04-01), Tanaka et al.
“Provisional Specification for 300-mm Front-Opening Interface Mechanical Standard (FIMS)”, SEMI E62-0997 (1997).

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