Front-end processing of nickel plated bond pads

Details Front-end processing of nickel plated bond pads Front-end processing of nickel plated bond pads

2007-06-05

2007-06-05

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S618000, C438S672000, C438S700000, C257S758000

Reexamination Certificate

active

10902569

ABSTRACT:
A front-end method of fabricating nickel plated caps over copper bond pads used in a memory device. The method provides protection of the bond pads from an oxidizing atmosphere without exposing sensitive structures in the memory device to the copper during fabrication.

REFERENCES:
patent: 6825564 (2004-11-01), Gleason et al.
patent: 6946347 (2005-09-01), Gilton
patent: 2004/0036137 (2004-02-01), Gleason et al.
patent: 2005/0194255 (2005-09-01), Tiwari
patent: 2006/0022352 (2006-02-01), Moore et al.

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