Frequency trimming of surface acoustic wave devices

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156643, 156646, 156656, 156657, 204192E, 324 56, B44C 122, C03C 1500, C03C 2506, C23F 100

Patent

active

042784921

ABSTRACT:
A process is provided for trimming a SAW device while the device is energized and operating at its center frequency. By essentially selectively sputter-etching the substrate or the transducer material only, without requiring a masking operation, the center frequency and other electrical characteristics of the SAW device are trimmed in a precise and controlled manner.

REFERENCES:
patent: 4092588 (1978-05-01), Desormiere et al.
patent: 4176004 (1979-11-01), Johnson et al.

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