Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1980-01-21
1981-07-14
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156643, 156646, 156656, 156657, 204192E, 324 56, B44C 122, C03C 1500, C03C 2506, C23F 100
Patent
active
042784921
ABSTRACT:
A process is provided for trimming a SAW device while the device is energized and operating at its center frequency. By essentially selectively sputter-etching the substrate or the transducer material only, without requiring a masking operation, the center frequency and other electrical characteristics of the SAW device are trimmed in a precise and controlled manner.
REFERENCES:
patent: 4092588 (1978-05-01), Desormiere et al.
patent: 4176004 (1979-11-01), Johnson et al.
Cross Peter S.
Shreve William R.
Hewlett--Packard Company
Powell William A.
Wong Edward Y.
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