Patent
1977-06-07
1979-02-06
James, Andrew J.
357 68, 357 72, 357 69, 357 80, H01L 2948, H01L 2944, H01L 2952
Patent
active
041386914
ABSTRACT:
In a framed lead assembly for a semiconductor element, conductive lead strips comprising inward end portions for connection to electrode areas of the semiconductor element are supported to a frame by reinforcing strips of an insulating material made integral with at least center portions of the respective lead strips and a connection arrangement connecting the reinforcing strips with the frame. The connection arrangement may comprise those outward end regions of the respective reinforcing strips which are made integral with the frame of the insulating material and those outward end areas of the respective lead strips which are attached to the frame. The reinforcing strips may be connected together by bridge members of either the insulating material or another insulating material. Alternatively, the connection arrangement may comprise bridge members connecting the reinforcing strips together and supporting members connecting the bridge members with the frame with outward end portions of the lead strips either separated from the frame or having outward end areas extended further outwardly of the respective outward end portions and attached to the frame. Preferably, the frame and the bridge and supporting members are of the insulating material and made integral with one another with the outward end portions being not made integral with the reinforcing strips. Also preferably, the inward end portions are not made integral with the reinforcing strips in whichever structure of the connection arrangement.
REFERENCES:
patent: 3192307 (1965-06-01), Lazar
patent: 3450956 (1969-06-01), Bauer et al.
patent: 3544857 (1970-12-01), Byrne et al.
patent: 3751724 (1973-08-01), McGrath et al.
patent: 3942245 (1976-03-01), Jackson et al.
patent: 3975757 (1976-08-01), Sporck
patent: 4063993 (1977-12-01), Burns
Bonkohara Manabu
Kasuga Hisao
James Andrew J.
Nippon Electric Co. Ltd.
LandOfFree
Framed lead assembly for a semiconductor device comprising insul does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Framed lead assembly for a semiconductor device comprising insul, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Framed lead assembly for a semiconductor device comprising insul will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-894062