Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1982-11-18
1983-10-18
Lusignan, Michael R.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430318, 430323, 156646, 1566591, 1566611, 156664, 156665, 156666, 156668, 204192D, B05D 306
Patent
active
044106220
ABSTRACT:
A method for forming feedthrough connections, or via studs, between levels of metallization which are typically formed atop semiconductor substrates. A conductive pattern is formed which includes the first level metallurgy, an etch barrier and the feedthrough metallurgy in the desired first level metallurgical configuration. The via stud metallurgy alone is then patterned, preferably by reactive ion etching, using the etch barrier to prevent etching of the first level metallurgy. An insulator is then deposited around the via studs to form a planar layer of studs and insulator, after which a second level of metallization may be deposited.
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Dalal Hormazdyzr D.
Patnaik Bisweswar
Sarkary Homi G.
Bueker Richard
Coca T. Rao
International Business Machines - Corporation
Lusignan Michael R.
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