Forming an electrical contact on an electronic component

Details Forming an electrical contact on an electronic component Forming an electrical contact on an electronic component

2006-03-21

2006-03-21

Smoot, Stephen W. (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S615000

Reexamination Certificate

active

07015132

ABSTRACT:
A method of constructing an electrical contact on an electronic component comprises first forming a protruding electrically conducting stud at a contact location by wire bonding a metal wire to a contact pad of the component. The stud is then contacted with solder, without using a mask, so that a solder bump is deposited on and adheres to the metal stud to form a composite solder contact which is able to form with a contact of another component a solder joint which has good electrical and mechanical properties and which may be reliable fabricated at high density by a low cost method. An electronic component provided with such solder contacts and an electronics component package including such a component are also disclosed.

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