Forming a thin film thermoelectric cooler and structures...

Details Forming a thin film thermoelectric cooler and structures... Forming a thin film thermoelectric cooler and structures...

2005-12-07

2010-11-16

Monbleau, Davienne (Department: 2893)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Thermally responsive

C257S467000, C257SE27008, C136S203000

Reexamination Certificate

active

07833816

ABSTRACT:
Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a first plurality of openings through a first surface of a substrate, forming a p-type TFTEC material within the first plurality of openings, forming a second plurality of openings substantially adjacent to the first plurality of openings through the first surface of the substrate, and then forming an n-type TFTEC material within the second plurality of openings.

REFERENCES:
patent: 6127619 (2000-10-01), Xi et al.

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