Forming a thin film electric cooler and structures formed...

Details Forming a thin film electric cooler and structures formed... Forming a thin film electric cooler and structures formed...

2011-03-08

2011-03-08

Monbleau, Davienne (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Magnetic field

C257S930000, C257SE27008, C136S203000

Reexamination Certificate

active

07902617

ABSTRACT:
Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a first plurality of openings through a first surface of a substrate, forming a p-type TFTEC material within the first plurality of openings, forming a second plurality of openings substantially adjacent to the first plurality of openings through the first surface of the substrate, and then forming an n-type TFTEC material within the second plurality of openings.

REFERENCES:
patent: 6127619 (2000-10-01), Xi et al.

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