Forming a substrate core with embedded capacitor and...

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Reexamination Certificate

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C361S311000, C361S313000, C361S306100, C361S321100, C361S321400

Reexamination Certificate

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11218357

ABSTRACT:
Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.

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Pending U.S. Appl. No. 11/027,386, filed Dec. 30, 2004, inventor: Srinivasan.

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