Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...
Reexamination Certificate
2006-06-06
2006-06-06
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Reexamination Certificate
active
07056834
ABSTRACT:
An aspect of the present invention is a method for forming a plurality of thin-film devices. The method includes providing a flexible substrate and utilizing a self-aligned imprint lithography (SAIL) process to form the plurality of thin-film devices on the flexible substrate.
REFERENCES:
patent: 2002/0132482 (2002-09-01), Chou
Jackson Warren B.
Jeans Albert
Mei Ping
Taussig Carl Philp
Geyer Scott B.
Hewlett--Packard Development Company, L.P.
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