Forming a micro electro mechanical system

Details Forming a micro electro mechanical system Forming a micro electro mechanical system

2010-11-17

2011-12-27

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S050000, C438S051000, C438S053000, C438S054000, C438S055000

Reexamination Certificate

active

08084285

ABSTRACT:
A method of forming a micro-electro mechanical system (MEMS), includes (1) removing material from a first wafer to define a first movable portion corresponding to an x-y accelerometer and a second movable portion corresponding to a z accelerometer, where each movable portion comprises at least one flexure member and at least one proof mass, each proof mass and flexure member being formed by the selective removal of material from a top side and a bottom side of first wafer; (2) bonding the first wafer to a second wafer comprising an electronic circuit, such that a gap is defined between the first wafer and the second wafer. The thickness of the at least one flexure member of the first movable portion is independent of a thickness of the at least one flexure member of the second movable portion and a thickness of the proof mass of the first movable portion is independent of a thickness of the at least one proof mass of the second movable portion.

REFERENCES:
patent: 4773015 (1988-09-01), Leland et al.
patent: 5144598 (1992-09-01), Engdahl et al.
patent: 5747353 (1998-05-01), Bashir et al.
patent: 5865417 (1999-02-01), Harris et al.
patent: 6294400 (2001-09-01), Stewart et al.
patent: 6504385 (2003-01-01), Hartwell et al.
patent: 6633256 (2003-10-01), Zhdanov et al.
patent: 6936492 (2005-08-01), McNeil et al.
patent: 6978673 (2005-12-01), Johnson et al.
patent: 7083997 (2006-08-01), Brosnihhan et al.
patent: 7205174 (2007-04-01), Hung
patent: 7223624 (2007-05-01), Wu et al.
patent: 7354788 (2008-04-01), Bar-Sadeh et al.
patent: 7393714 (2008-07-01), Oguchi
patent: 7444873 (2008-11-01), Robert
patent: 2002/0020053 (2002-02-01), Fonash et al.
patent: 2004/0246648 (2004-12-01), Katou et al.
patent: 2005/0091843 (2005-05-01), Yu
patent: 2005/0150297 (2005-07-01), Ayazi et al.
patent: 2005/0166677 (2005-08-01), Nasiri et al.
patent: 2006/0208326 (2006-09-01), Nasiri et al.
patent: 2006/0223220 (2006-10-01), Bower
patent: 2007/0029629 (2007-02-01), Yazdi
patent: 2007/0059857 (2007-03-01), Sooriakumar et al.
patent: 9524658 (1995-09-01), None
patent: 0180286 (2001-10-01), None

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