Forming a contact in a thin-film device

Details Forming a contact in a thin-film device Forming a contact in a thin-film device

2006-01-24

2006-01-24

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S668000, C438S951000, C438S508000, C257SE21508

Reexamination Certificate

active

06989327

ABSTRACT:
An aspect of the present invention is a method of forming a contact in a thin-film device. The method includes forming a liftoff stencil, depositing at least one material through the liftoff stencil, removing a portion of the liftoff stencil, forming a re-entrant profile with the remaining portion of the liftoff stencil and depositing a conductor material in contact with the at least one material on the re-entrant profile.

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