Forming a color filter on a semiconductor substrate

Details Forming a color filter on a semiconductor substrate Forming a color filter on a semiconductor substrate

1993-02-22

1994-09-27

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156668, 437 53, 437228, B44C 122, B29C 3700

Patent

active

053504909

ABSTRACT:
A manufacturing method for color filter comprises steps of forming a flat layer for smoothing over an image sensor having charge coupled devices or bucket brigade device, forming a first color filter layer and a first inter-layer of dye-proof layer on said flat layer, alternately forming color filter layers and inter-layers in the same manner as above describe steps in order to form a second color filter layer, a second inter-layer, a third color filter layer and a third inter-layer, wherein the first or the third inter-layer is formed of a negative polyimide having a relatively lower thermal shrinkage. In this method, the material for forming the inter-layer which has been the problem in thermal hardening due to the relatively higher thermal shrinkage is substituted with the negative polyimide having a relatively lower thermal shrinkage, so that the stress acted on the interface between the color filter layer and the inter-layer can be minimized, so that image sensor having a superior spectrum characteristic and sensitivity can be obtained.

REFERENCES:
patent: 5185059 (1993-02-01), Nishida et al.

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