Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2009-09-24
2010-06-08
Kebede, Brook (Department: 2894)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C257SE23193
Reexamination Certificate
active
07732240
ABSTRACT:
Providing through-wafer interconnections in a semiconductor wafer includes forming a sacrificial membrane in a preexisting semiconductor wafer, depositing metallization over one side of the wafer so as to cover exposed portions of the sacrificial membrane facing the one side of the wafer, removing exposed portions of the sacrificial membrane facing the other side of the wafer, and depositing metallization over the other side of the wafer so as to contact the previously deposited metallization. Techniques also are disclosed for providing capacitive and other structures using thin metal membranes.
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Fish & Richardson P.C.
Hymite A/S
Kebede Brook
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