Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-07-18
2006-07-18
Le, Thao P. (Department: 2818)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S258000, C438S526000, C257S019000
Reexamination Certificate
active
07078335
ABSTRACT:
Method for making a semiconductor structure is proposed. It comprises the steps: —providing a base layer (10) having a first lattice constant, —forming buried islands on the base layer (10) having a second lattice constant that is smaller or larger than the first lattice constant, —at least partially covering the base layer (10) and the buried islands with a cover layer (14), whereby the cover layer (14) has a locally increased or reduced lattice constant in areas above the buried islands, —growing small islands (15) on the areas of the cover layer (14) with locally increased or reduced lattice constant, —depositing a thin layer (16) at least partially covering the cover layer (14) and the small islands (15), —at least partially removing the small islands (15) to provide for an opening (17) being positioned exactly above the buried islands.
REFERENCES:
patent: 6271551 (2001-08-01), Schmitz et al.
patent: 6727550 (2004-04-01), Tezuka et al.
patent: 6841410 (2005-01-01), Sasaoka
patent: 6852638 (2005-02-01), Johansson et al.
Le Thao P.
Moetteli John
Moetteli & Associes Sarl
Paul Scherrer Institut
LandOfFree
Formation of self-organized stacked islands for self-aligned... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Formation of self-organized stacked islands for self-aligned..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Formation of self-organized stacked islands for self-aligned... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3528488