Formation of holes in substrates using dewetting coatings

Details Formation of holes in substrates using dewetting coatings Formation of holes in substrates using dewetting coatings

2006-09-20

2009-11-03

Quach, Tuan N. (Department: 2893)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S631000, C438S637000, C438S644000, C257SE21585

Reexamination Certificate

active

07611985

ABSTRACT:
Methods and systems for forming holes in a substrate using dewetting coating are described herein.

REFERENCES:
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patent: 2008/0265414 (2008-10-01), Ho et al.
patent: 2009/0155964 (2009-06-01), Chang et al.
Zhang et al., “How to form regular polymer microstructures by surface-pattern-directed dewetting,” Surface Science 539 (2003) 129-136.
Feng et al., “Infululence of Polymer Nanoparticles on the Dewetting of Polymer Thin Films,” Aug. 30, 2005, UM Theses and Dissertations Materials & Science.
Engineering Theses and Dissertations, http://hdl.handle.net/1903/2829.

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