Formation of etch-resistant resists through preferential permeat

Details Formation of etch-resistant resists through preferential permeat Formation of etch-resistant resists through preferential permeat

1985-06-06

1986-09-23

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156643, 156646, 1566591, 156668, 156904, 427 41, 427 431, 430313, B44C 122, C03C 1500, C03C 2506, B29C 1708

Patent

active

046133984

ABSTRACT:
A method is provided for creation of oxygen etch-resistant polymeric films for use in the production of micron and submicron dimension patterns and fine lines. These etch-resistant polymeric films find use in fabrication of complex structures such as those in electronic devices and magnetic thin film heads. The etch resistance is achieved by incorporation of a protective-oxide-forming metal into a polymeric material using preferential permeation of organometallic materials into the polymeric material.

REFERENCES:
patent: 4357369 (1982-11-01), Kilichowski et al.
patent: 4396704 (1983-08-01), Taylor
patent: 4426247 (1984-01-01), Tamamura et al.
patent: 4430153 (1984-02-01), Gleason et al.
patent: 4433044 (1984-02-01), Meyer et al.
patent: 4552833 (1985-11-01), Ito et al.

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