Formation of a metal via using a raised metal plug structure

Details Formation of a metal via using a raised metal plug structure Formation of a metal via using a raised metal plug structure

1996-04-29

1998-12-01

Everhart, Caridad

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438647, 438642, 438942, 438657, 438669, H01L 2144

Patent

active

058438394

ABSTRACT:
A process has been developed which allows contact between levels of interconnect metallization structures, to occur without the use of via holes, etched in interlevel insulator layers. The process features creation of a raised tungsten plug structure, used to provide contact between underlying active device regions and an overlying interconnect metallization structure. The tungsten plug structure is formed by photolithographic masking and dry etching procedures, thus avoiding increasing the size of a tungsten seam, in the center of the plug structure. In addition the tungsten definition process, also results in a raised plug structure, allowing subsequent contact of interconnect metallization levels to proceed without the use of etched via holes in interlevel insulator layers.

REFERENCES:
patent: 4917759 (1990-04-01), Fisher et al.
patent: 5243220 (1993-09-01), Shibata et al.
patent: 5262354 (1993-11-01), Cote et al.
patent: 5279988 (1994-01-01), Saadat et al.
patent: 5312512 (1994-05-01), Allman et al.
patent: 5444022 (1995-08-01), Gardner

Affiliated with

Also associated with

Rating

Formation of a metal via using a raised metal plug structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Formation of a metal via using a raised metal plug structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Formation of a metal via using a raised metal plug structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2395438