Forced plug processing for high aspect ratio structures

Details Forced plug processing for high aspect ratio structures Forced plug processing for high aspect ratio structures

1997-10-03

1999-10-12

Booth, Richard A.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438668, 438672, 438675, 438677, 438906, 438963, H01L 214763

Patent

active

059666315

ABSTRACT:
A forced plug process for high aspect ratio structures. The process comprises the steps of providing a liquid plug in a high aspect ratio structure; increasing a gas pressure to force the liquid plug down into the high aspect ratio structure; and suddenly decreasing the gas pressure allowing the liquid plug to be ejected from the high aspect ratio structure. The process is useful for removing unwanted particles from a high aspect ratio structure, as well as for etching and coating the side walls of the structure.

REFERENCES:
patent: 5261965 (1993-11-01), Moslehi
patent: 5350480 (1994-09-01), Gray
IBM TDB vol. 23 No. 5, Oct. 1980: Anti-Turbulent Vent (Vacuum) Device: J.E. Jamieson, S.I. Petvai and C. Rosu.

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