Folded bus bar leadframe

Details Folded bus bar leadframe Folded bus bar leadframe

1992-09-08

1994-02-15

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257691, 257692, 257696, 257700, H01L 2348

Patent

active

052869997

ABSTRACT:
A leadframe has a bus bar extending between two lead fingers on the leadframe. The bus bar and lead fingers are etched to reduce the thickness thereof, and the bus bar is folded under the lead finger, but insulated therefrom by a strip of insulating material. An adhesive is applied to the bus bar to attach it and the leadframe to the surface of a semiconductor chip.

REFERENCES:
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4965654 (1990-10-01), Karner et al.
patent: 5105257 (1992-04-01), Michii

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