Foil for a printed circuit

Details Foil for a printed circuit Foil for a printed circuit

1995-04-07

1996-10-22

Silverberg, Sam

Stock material or miscellaneous articles

All metal or with adjacent metals

Foil or filament smaller than 6 mils

428658, 428624, 148269, B32B 1520

Patent

active

055675344

ABSTRACT:
A copper foil for printed circuits of which a shiny side has resin dust resistance, excels in heat discloration resistance and rust preventiveness, and does not adversely affect the solderability and resist adhesion, and a method of treating the surface of such copper foil. The copper foil for a printed circuit comprises a first layer of zinc alloy composed of zinc and nickel and/or cobalt, formed on the shiny side surface of a copper foil, and a second layer composed of a mixture or compound of benzotriazole derivative and phosphorus compound (and silicon compound) formed on the layer. The method for treating the surface of a copper foil for a printed, circuit comprises the steps of forming a first layer of zinc alloy composed of zinc and nickel and/or cobalt be electroplating on the shiny side surface of a copper foil, and forming a second layer by immersing it in an aqueous solution of benzotriazole derivative and phosphorus compound (and silicon compound).

REFERENCES:
patent: 4061837 (1977-12-01), Hutkin
patent: 5338619 (1994-08-01), Fukuda
patent: 5362334 (1994-11-01), Adams
patent: 5435860 (1995-07-01), Maki

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