Foamed elastomers for wafer probing applications and interposer

Details Foamed elastomers for wafer probing applications and interposer Foamed elastomers for wafer probing applications and interposer

1996-11-19

2000-04-25

Reichard, Dean A.

Electricity: conductors and insulators

Conduits, cables or conductors

Insulated

H01B 700

Patent

active

060546514

ABSTRACT:
The present invention is directed to a new foamed elastomer composition including elastomer, hollow fillers, and reinforced fillers for supporting the conducting wires in the test probes for wafer level testing and burn in and interposer connector applications. The thermally stable elastomer resin is mixed with hollow fillers and reinforced fillers before filling into the probe or connector mold with an array of elongated conducting wires, then is crosslinked by a crosslinking agent and a catalyst. The use of compressible hollow fillers to foam the elastomer has been successful to enhance the compliance and resilience, and to reduce the thermal expansion, density, and dielectric constant of the elastomer.

REFERENCES:
patent: 2948020 (1960-08-01), D'Ascoli
patent: 3576388 (1971-04-01), Bruns
patent: 3985951 (1976-10-01), Harris
patent: 4379858 (1983-04-01), Suzuki
patent: 4423282 (1983-12-01), Suzuki et al.
patent: 4443657 (1984-04-01), Hill et al.
patent: 4450376 (1984-05-01), Meitzler
patent: 4647716 (1987-03-01), Akiyama et al.
patent: 5286924 (1994-02-01), Loder et al.
patent: 5441690 (1995-08-01), Ayala-Esquilin et al.
patent: 5455392 (1995-10-01), Preu et al.
patent: 5519172 (1996-05-01), Spencer et al.
patent: 5562985 (1996-10-01), Sano et al.

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