Fluxless solder ball attachment process

Details Fluxless solder ball attachment process Fluxless solder ball attachment process

1996-09-20

1999-05-04

Niebling, John F.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438661, 438662, 257738, 29843, H01L 23488, H01L 2144

Patent

active

058997377

ABSTRACT:
A fluxless method for fusing preformed solder balls to contact pads on a semiconductor package substrate wherein a masking plate having one or more vertical holes corresponding to the contact pads is placed over the package substrate, oxide-free solder balls are placed in the holes, the assembly is preheated to a temperature less than the melting point of the solder, and an energetic beam is directed onto the preformed solder balls to melt them and fuse them to the contact pads.

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patent: 5451274 (1995-09-01), Gupta
patent: 5492265 (1996-02-01), Wandke
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patent: 5597469 (1997-01-01), Carey et al.
patent: 5609290 (1997-03-01), Bobbio et al.
patent: 5663594 (1997-09-01), Kimura

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