Fluxless reflow process for bump formation

Details Fluxless reflow process for bump formation Fluxless reflow process for bump formation

2007-09-21

2010-11-23

Brewster, William M. (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000

Reexamination Certificate

active

07838411

ABSTRACT:
A fluxless reflow process for bump formation is provided, which includes: a purifying process for keeping solder in a state of melting or half-melting for 40 s to 540 s; a ball-forming process for melting the solder completely to form ball-like bumps; and a cooling process. The splashing of solder can be avoided and the defect that there may be solder balls around the bumps can be eliminated.

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patent: WO 2005/022592 (2005-03-01), None
Chinese Office Action of related application mailed Oct. 24, 2008, 4 pgs. without translation.

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