Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-09-21
2010-11-23
Brewster, William M. (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S613000
Reexamination Certificate
active
07838411
ABSTRACT:
A fluxless reflow process for bump formation is provided, which includes: a purifying process for keeping solder in a state of melting or half-melting for 40 s to 540 s; a ball-forming process for melting the solder completely to form ball-like bumps; and a cooling process. The splashing of solder can be avoided and the defect that there may be solder balls around the bumps can be eliminated.
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Chinese Office Action of related application mailed Oct. 24, 2008, 4 pgs. without translation.
Li Runling
Wang Tsing-Chow
Brewster William M.
Semiconductor Manufacturing International (Shanghai) Corporation
Squire Sanders & Dempsey L.L.P.
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