Fluororesin fiber paper, copper-clad laminate for printed...

Paper making and fiber liberation – Processes and products – With coating after drying

Reexamination Certificate

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C162S145000, C162S146000, C162S157500, C162S192000

Reexamination Certificate

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06942756

ABSTRACT:
The invention provides fluororesin fiber paper excellent in adhesion to a copper foil, heat resistance, chemical resistance, low water absorption and electric insulation and capable of being used as a substrate of a printed board suitable for use in high frequency, of which a low dielectric loss is required. The fluororesin fiber paper is a porous sheet obtained by forming a slurry comprising fluororesin fiber into a sheet by a wet paper making method and sintering the resultant sheet and has an average pore diameter of 0.5 to 50 μm and a maximum pore diameter of at most 250 μm. A copper-clad laminate for printed board is produced by laminating the fluororesin fiber paper and a copper foil having a ten point mean height of surface roughness profile (Rz) of 0.5 to 8.0 μm on each other by means of vacuum hot pressing.

REFERENCES:
patent: 3003912 (1961-10-01), Harford
patent: 3015604 (1962-01-01), Hochberg
patent: 3186897 (1965-06-01), Hochberg
patent: 3960651 (1976-06-01), Kometani et al.
patent: 4133927 (1979-01-01), Tomoda et al.
patent: 5470409 (1995-11-01), Deakyne et al.
patent: 5506052 (1996-04-01), Deakyne et al.

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