Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2011-01-25
2011-01-25
Lee, Hsien-ming (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S780000, C438S798000, C257SE23167
Reexamination Certificate
active
07875549
ABSTRACT:
A film forming method includes the steps of forming a F-doped carbon film by using a source gas containing C and F, and modifying the F-doped carbon film by radicals, the source gas having a F/C ratio larger than 1 smaller than 2, the F/C ratio being defined as a ratio of a number of F atoms to a number of C atoms in a source gas molecule.
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Asano Akira
Nishizawa Kenichi
Terai Yasuhiro
Lee Hsien-Ming
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Parendo Kevin
Tokyo Electron Limited
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