Fluorine-containing base layer for multi-layer resist processes

Details Fluorine-containing base layer for multi-layer resist processes Fluorine-containing base layer for multi-layer resist processes

1988-10-17

1990-12-18

Dees, Jose G.

Radiation imagery chemistry: process, composition, or product th

Imaged product

Multilayer

430 17, 430 18, 430323, 430325, G03F 726

Patent

active

049785940

ABSTRACT:
A process for forming a pattern on a substrate utilizing photolithographic techniques. In this process a layer of polymeric material containing a fluorine-containing compound is applied over the substrate and cured. A layer of photoresist material is applied over the polymeric material imagewise exposed and developed to reveal the image on the underlying polymeric material. Thereafter, the photoresist is silylated, and the structure is reactive ion etched to transfer the pattern to the underlying substrate. The fluorine component provides an underlying structure free of residue and cracking.

REFERENCES:
patent: 4243476 (1981-01-01), Ahn et al.
patent: 4357203 (1982-11-01), Zelez
patent: 4396479 (1983-08-01), Jones
patent: 4456501 (1984-06-01), Bayman et al.
patent: 4501061 (1985-02-01), Wonnacott
patent: 4529474 (1985-07-01), Fujiyama
patent: 4547261 (1985-10-01), Maa et al.
patent: 4552833 (1985-11-01), Ito et al.
patent: 4599243 (1986-07-01), Sachdev et al.
patent: 4613400 (1986-09-01), Tam et al.
Dobkin et al., "Plasma Formation of Buffer Layers for Multilayer Resist Structures", IEEE Electron Device Letters vol. EDL2, No. 9, Sep. 1981, pp. 222-224.
Lyman et al., "Lift-Off of Thick Metal Layers Using Multilayer Resist", J. Vac. Sci. Technol., 19(4), Nov./Dec. 1981, pp. 1325-1328.

Affiliated with

Also associated with

Rating

Fluorine-containing base layer for multi-layer resist processes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fluorine-containing base layer for multi-layer resist processes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fluorine-containing base layer for multi-layer resist processes will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1425383