Fluids for immersion lithography systems

Details Fluids for immersion lithography systems Fluids for immersion lithography systems

2007-11-06

2007-11-06

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Miscellaneous

C355S053000

Reexamination Certificate

active

11170200

ABSTRACT:
Fluids for use in immersion lithography systems are disclosed. A resistivity-altering substance is introduced into a fluid, making it more conductive. The fluid is then disposed between an immersion head of a projection lens system and a semiconductor wafer during an exposure process. Because the fluid is conductive, electrostatic energy that may develop during the movement of the semiconductor wafer with respect to the projection lens system during the exposure process is discharged through the conductive fluid, preventing damage to an immersion head of the projection lens system, the semiconductor wafer, and sensors of a stage that supports the semiconductor wafer.

REFERENCES:
patent: 7170583 (2007-01-01), Van Der Meulen et al.
patent: 2005/0048220 (2005-03-01), Mertens et al.
patent: 2005/0048813 (2005-03-01), Streefkerk et al.
patent: 1 522 894 (2005-04-01), None
patent: WO 2005/050324 (2005-06-01), None
patent: WO 2005/062351 (2005-07-01), None
“Technology Backgrounder: Immersion Lithography,” downloaded Apr. 20, 2005, pp. 1-5, IC Knowledge, http://www.icknowledge.com/misc—technology/immersion%20Lithography.pdf.

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