Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1986-12-30
1989-01-31
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
118729, 118 501, 118620, 156646, 156345, 156668, 427 531, 427 541, 4272481, 21912169, 21912185, 21912184, 21912161, B44C 122, C03C 1500, B05D 306, B23K 900
Patent
active
048013528
ABSTRACT:
A controlled gas environment is provided against a surface area of a semiconductor wafer for performing processes on the area in the fabrication of integrated circuits thereon, including processes of deposition, impurity implantation, etching, ablation, and other radiation induced chemical processes involving the gas atmosphere by maintaining a continuous gas flow over the area and a portion of the surrounding area of the wafer surface covered by an enclosure that is suspended on the surface on a film of the flowing gas, the pressure, temperature and composition of the gas atmosphere against the surface area being controlled to meet the requirements of each processing step and/or to carry away particles while the gas seal is maintained. In a particular embodiment, intense ultraviolet (UV) laser radiation is focused by an optical system on a target on the semiconductor wafer surface through the suspended enclosure while the wafer is held on a table that moves in the plane of the wafer surface in order to expose different selected areas of the surface to the combined effects of the UV radiation and the gas atmosphere.
REFERENCES:
patent: 4414059 (1983-11-01), Blum et al.
patent: 4478677 (1984-10-01), Chen et al.
patent: 4534816 (1985-08-01), Chen et al.
patent: 4544446 (1985-10-01), Cady
Dunn Robert T.
Image Micro Systems, Inc.
Powell William A.
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