Floating-gate memory cell having trench structure with...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S328000, C438S270000

Reexamination Certificate

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06958513

ABSTRACT:
A method of forming an array of floating gate memory cells, and an array formed thereby, wherein each memory cell includes an electrical conductive floating gate formed in a trench in a semiconductor substrate, and an electrical conductive control gate having a portion disposed over and insulated from the floating gate. An electrical conductive tunneling gate is disposed over and insulated from the control gate by an insulating layer to form a tri-layer structure permitting both electron and hole charges tunneling through at similar tunneling rate. Spaced apart source and drain regions are formed with the source region disposed adjacent to and insulated from a lower portion of the floating gate, and with the drain region disposed adjacent to and insulated from an upper portion of the floating gate with a channel region formed therebetween and along a sidewall of the trench.

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Kitamura T. et al., “A Low Voltage Operating Flash Cell with High Coupling Ratio Using Horned Floating gate with Fine HSG”, Symposium on VLSI Tech Digest, p. 104, 1998.
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Kuo et al., “TEFET—A High Density, Low Erase Voltage, Trench Flash EEPROM”, Symposium on VLSI Tech Digest, p. 51, 1994.
H. Pein et al, “Performance of the 3-D Sidewall Flash EPROM Cell”, IEDM Tehnical Digest, pp. 11-14, 1993.

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