Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2008-04-22
2008-04-22
Dinh, Paul (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C716S030000, C716S030000
Reexamination Certificate
active
07363606
ABSTRACT:
A method for inserting flip-flops in an interconnect is provided such that a cycle time constraint for the interconnect is satisfied. First of all, a flop is inserted at an initial placement at a node along a signal path of the interconnect such that a downstream delay relative to the initial placement of the flop is not greater than the cycle time constraint for the net. Secondly, the initial placement of the flop is optimized such that a delay difference, defined by a downstream delay minus an upstream delay, relative to an optimal placement at a downstream node along the signal path of the net is not greater than zero. The disclosed method can also satisfy the flop stage requirement and/or a minimum number of flops requirement for an interconnect.
REFERENCES:
patent: 6286128 (2001-09-01), Pileggi et al.
patent: 6910196 (2005-06-01), Cocchini
patent: 6925625 (2005-08-01), Kim
patent: 6931614 (2005-08-01), Jung et al.
patent: 6973632 (2005-12-01), Brahme et al.
patent: 7072815 (2006-07-01), Chaudhary et al.
patent: 2004/0025134 (2004-02-01), Jung et al.
patent: 2004/0153984 (2004-08-01), Akkiraju
patent: 2005/0062496 (2005-03-01), Gidon et al.
patent: 2005/0132316 (2005-06-01), Suaris et al.
Gopalan Manoj
Mo Yu-yen
Podduturi Venkat R.
Dinh Paul
Martine & Penilla & Gencarella LLP
Nguyen Nha
Sun Microsystems Inc.
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