Flip-flop insertion in a circuit design

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

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C716S030000, C716S030000

Reexamination Certificate

active

06910195

ABSTRACT:
A method and apparatus for inserting flip-flops in a circuit design between a driver and one or more receiver(s) comprising generating a candidate solution to assign the flip-flop at the node in the circuit, calculating a margin at the driver, calculating the margin at the receiver, and inserting the flip-flop at the node to simultaneously maximize the margin at the driver and the margin at the receiver. Furthermore, the method and apparatus determines whether to insert a second flip-flop at a second node in the circuit, and inserting the second flip-flop at the second node in the circuit such that a delay between the flip-flop and the second flip-flop is substantially equal to a clock period.

REFERENCES:
patent: 6117182 (2000-09-01), Alpert et al.
patent: 6550044 (2003-04-01), Pavisic et al.
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Vesterbacka,“A Static CMOS Master-Slave Flip-Flop Experiment”,Dec. 2000, IEEE 7thInternational Conference on Electronics Circuits and Systems, vol. 2, pp. 870-873.
Cocchini, Pasquale , “Concurrent Flip-Flop and Repeater Insertion for High Performance Integrated Circuits”,IEEE/ACM International Conference on Computer Aided Design. IEEE/ACM Digest of Technical Papers, (2002),268-273.
Hassoun, Soha , “Optimal Buffered Routing Path Constructions for Single and Multiple Clock Domain Systems”,IEEE/ACM International Conference on Computer Aided Design. IEEE/ACM Digest of Technical Papers, IEEE No. 0-7803-7607-2/02; IBM Austin Research Laboratory, Austin, TX,(2002),pp. 247-253.
Lillis, J , et al., “Optimal wire sizing and buffer insertion for low power and a generalized delay model”,IEEE Journal of Solid-State Circuits, 31(3), (Mar. 1996),437-447.
Lu, Ruibing , et al., “Flip-Flop and Repeater Insertion for Early Interconnect Planning”,Proceedings 2002 Design, Automation and Test in Europe Conference and Exhibition, (2002),690-695.
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