Flip-chip without bumps and polymer for board assembly

Details Flip-chip without bumps and polymer for board assembly Flip-chip without bumps and polymer for board assembly

2005-07-05

2005-07-05

Thai, Luan (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C257S780000

Reexamination Certificate

active

06914332

ABSTRACT:
A semiconductor chip having a planar active surface including an integrated circuit protected by an inorganic overcoat; the circuit has metallization patterns including a plurality of contact pads. Each of these contact pads has an added conductive layer on the circuit metallization. This added layer has a conformal surface adjacent the chip, including peripheral portions of the overcoat, and a planar outer surface; this outer surface is suitable to form metallurgical bonds without melting. The chip contact pads may have a distribution arrayed in the center of the chip in close proximity to the chip neutral line; the distribution may leave an area portion of the active chip surface available for attaching a thermally conductive plate. The chip may further have a non-conductive adhesive layer over the overcoat, filling the spaces between the added conductive layers on each contact pad.

REFERENCES:
patent: 5053851 (1991-10-01), Berndlmaier et al.
patent: 5693565 (1997-12-01), Camilletti et al.
patent: 5943597 (1999-08-01), Kleffner et al.
patent: 6287893 (2001-09-01), Elenius et al.
patent: 6426281 (2002-07-01), Lin et al.
patent: 6426556 (2002-07-01), Lin
patent: 6605524 (2003-08-01), Fan et al.

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