Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2005-03-01
2005-03-01
Mai, Son L. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S355000, C257S691000, C257S692000, C257S207000, C257S786000
Reexamination Certificate
active
06861762
ABSTRACT:
A flip chip assembly comprising a semiconductor die having a core area and a periphery area. The periphery area including an ESD structure. The semiconductor die includes at least one power conductor to supply power between the core area and the periphery. A substrate is coupled to the semiconductor die via a plurality of electrically conductive bumps. A first connection circuit is located within the semiconductor die core area to couple power between the substrate and the semiconductor die power conductor. An electrically conductive bump provides a connection between the first connection circuit and the substrate. The ESD structure is coupled to the first connection circuit.
REFERENCES:
patent: 4359754 (1982-11-01), Hayakawa et al.
patent: 4403240 (1983-09-01), Seki et al.
patent: 5384487 (1995-01-01), Rostoker et al.
patent: 5641978 (1997-06-01), Jassowski
patent: 5719449 (1998-02-01), Strauss
patent: 5838072 (1998-11-01), Li et al.
patent: 5869870 (1999-02-01), Lin
patent: 5905639 (1999-05-01), Warren
patent: 5960262 (1999-09-01), Torres et al.
patent: 5986345 (1999-11-01), Monnot
patent: 6025616 (2000-02-01), Nguyen et al.
patent: 6043539 (2000-03-01), Sigasawara
patent: 6078068 (2000-06-01), Tamura
patent: 6091140 (2000-07-01), Toh et al.
patent: 6097098 (2000-08-01), Ball
patent: 6107681 (2000-08-01), Lin
patent: 6144093 (2000-11-01), Davis et al.
patent: 6169331 (2001-01-01), Manning et al.
patent: 6169772 (2001-01-01), Fourcroy
patent: 6211565 (2001-04-01), Yu
patent: 6222213 (2001-04-01), Fujiwara
patent: 6246113 (2001-06-01), Lin
patent: 6372627 (2002-04-01), Ring et al.
patent: 6489688 (2002-12-01), Baumann et al.
patent: 6495925 (2002-12-01), Lee et al.
patent: 6518089 (2003-02-01), Coyle
patent: 6570251 (2003-05-01), Akram et al.
U.S. Appl. No. 10/051,965, Liou, filed Jan. 16, 2002.
U.S. Application No. 09/966,914, filed Sep. 27, 2001.
Huynh Andy
Mai Son L.
Marvell Semiconductor Israel Ltd.
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