Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
1999-10-05
2001-02-20
Potter, Roy (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S737000, C438S108000
Reexamination Certificate
active
06191488
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to a semiconductor package and a method of injecting a resin into the semiconductor package. This invention relates particularly to a flip chip type semiconductor package wherein a semiconductor chip is implemented on a substrate in face-down form.
2. Description of the Related Art
A semiconductor package of a type wherein a semiconductor chip is implemented on the surface of a circuit substrate and a connecting portion between the two is sealed with a resin or the like, has been disclosed in Japanese Patent Application Laid-Open No. Hei 7-302858 which was opened to the public by Japanese Patent Office in Nov. 14, 1995.
In this type of semiconductor package, a sealing resin is injected or poured between a circuit substrate and a semiconductor chip through the use of by capillary action so as to seal between the substrate and the chip as has been described in the paragraph [0023] on page 4 in the aforementioned publication.
Since the clearance or gap between the circuit substrate and the semiconductor chip is normally very narrow as in a range of 40 to 60 &mgr;m, the injected resin is hard to spread.
Since there has recently been a growing demand for a reduction in the thickness of this type of semiconductor package, such a clearance has the potential for becoming narrower. In such a case, it is considered that the resin will be increasingly harder to spread and a long time will be required for the resin to spread through the entire gap between the substrate and the chip.
SUMMARY OF THE INVENTION
With the foregoing in view, it is therefore an object of the present invention to provide a semiconductor package which makes it possible to facilitate spreading of a sealing resin when the sealing resin is formed between a substrate and a semiconductor chip.
It is another object of the present invention to provide a method of injecting a sealing resin, which is capable of forming the sealing resin between a substrate and a semiconductor chip uniformly.
In order to achieve the above objects, a typical invention of the present application provides a structure of a semiconductor package comprising a substrate, a semiconductor chip and a resin for sealing between the substrate and the semiconductor chip and wherein a concave portion is defined in the surface of the substrate.
Further, another typical invention provides a resin injecting method suitable for use in a semiconductor package, comprising the steps of placing a square semiconductor chip above the substrate and thereafter injecting the resin between the semiconductor chip and the substrate simultaneously from substantially the centers of each of three sides of the semiconductor chip.
According to the semiconductor package structure of the present invention, since a sufficient clearance can be ensured between the substrate and the semiconductor chip because the concave portion is defined in the surface of the substrate, the injected resin is easily spread.
According to the resin injecting method of the present invention, since the resin is injected substantially simultaneously substantially from the centers of the three sides of the square semiconductor chip, the resin can be injected between the substrate and the semiconductor chip uniformly and within a short time.
REFERENCES:
patent: 5818113 (1998-10-01), Iseki et al.
patent: 7-302858 (1995-11-01), None
OKI Electric Industry Co., Ltd.
Potter Roy
Rabin & Champagne, P.C.
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