Flip-chip structure and method for high quality inductors...

Details Flip-chip structure and method for high quality inductors... Flip-chip structure and method for high quality inductors...

2005-04-12

2005-04-12

Chen, Kin-Chan (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

C438S612000

Reexamination Certificate

active

06878633

ABSTRACT:
A structure and method for achieving a flip-chip semiconductor device having plated copper inductors (4), transformers (16), interconnect, and power busing that is electrically superior, lower cost, and provides for higher quality inductors as well as lower losses for on-chip transformers. Providing a solder dam (8, 24, 28) enables the fabrication of flip-chip solder bumps directly on to inductors and transformers.

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