Flip chip packaging structure and related packaging method

Details Flip chip packaging structure and related packaging method Flip chip packaging structure and related packaging method

2006-10-31

2006-10-31

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

Reexamination Certificate

active

07129586

ABSTRACT:
A bump is formed on a bonding pad provided on a substrate. A passivation film covering a bonding pad provided on a semiconductor chip is provided with two apertures in which bumps are formed. The bump provided on the substrate advances and enters into a clearance between these bumps provided on the semiconductor chip when the semiconductor chip is packaged with the substrate.

REFERENCES:
patent: 6425516 (2002-07-01), Iwatsu et al.
patent: 6448665 (2002-09-01), Nakazawa et al.
patent: 6551854 (2003-04-01), Hosomi et al.
patent: 6798072 (2004-09-01), Kajiwara et al.
patent: 53-62471 (1978-06-01), None
patent: 64-81264 (1989-03-01), None
patent: 5-235099 (1993-09-01), None
patent: 11-204913 (1999-07-01), None

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