Flip chip packaging process

Details Flip chip packaging process Flip chip packaging process

2007-08-14

2007-08-14

Le, Thao P. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257S787000, C257S620000, C257S778000, C438S108000, C438S110000, C438S112000, C438S113000

Reexamination Certificate

active

10906890

ABSTRACT:
A flip chip packaging process uses an underfill as an encapsultant to reduce the possibility of delamination from occurring due to differential coefficients of thermal expansion, and thus the reliability of a flip chip package structure can be increased. Furthermore, the flooding of the encapsulant over the cutting line need not be taken into consideration for cutting the substrate. Therefore, the usage area of the substrate usage is increased, i.e., more chips can be mounted per unit area of the substrate.

REFERENCES:
patent: 6991965 (2006-01-01), Ono
patent: 2003/0127748 (2003-07-01), Fang
patent: 2003/0183950 (2003-10-01), Bolken

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