Flip chip packaging of memory chips

Details Flip chip packaging of memory chips Flip chip packaging of memory chips

1997-05-30

1999-11-23

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257723, 257686, 257724, 257777, 257737, 257738, 29832, 29840, 361764, 361735, 361783, H01L 2350, H01L 2348, H05K 702, H05K 334

Patent

active

059905646

ABSTRACT:
The specification describes an interconnect strategy for memory chip packages to reduce or eliminate alpha particle contamination from the use of high lead solder interconnections in the vicinity of semiconductor memory cells. In the primary embodiment a high tin solder is recommended. A multi-layer under bump metallization is described that is compatible with high tin solders and flip-chip solder bump technology.

REFERENCES:
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4871914 (1989-10-01), Simon et al.
patent: 5360988 (1994-11-01), Uda et al.
patent: 5382300 (1995-01-01), Blonder et al.
patent: 5397747 (1995-03-01), Angiulli et al.
patent: 5406025 (1995-04-01), Carlstedt
patent: 5477067 (1995-12-01), Isamura et al.
patent: 5483421 (1996-01-01), Gedney et al.
patent: 5615477 (1997-04-01), Sweitzer
patent: 5629838 (1997-05-01), Knight et al.
patent: 5646828 (1997-07-01), Degani et al.
patent: 5718361 (1998-02-01), Braun et al.
patent: 5718367 (1998-02-01), Covell, II et al.

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