Flip-chip package having thermal expansion posts

Details Flip-chip package having thermal expansion posts Flip-chip package having thermal expansion posts

2005-09-28

2010-02-23

Nguyen, Ha Tran T (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C438S108000, C257S738000

Reexamination Certificate

active

07667473

ABSTRACT:
A semiconductor package having a substrate and a die includes a plurality of conductive posts attached to the substrate and bonded to an active surface of the die via a plurality of corresponding microbumps. The conductive posts are flexible and extend beyond the top surface of the substrate a sufficient distance to absorb lateral forces exerted upon the microbumps.

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