Flip-chip opto-electronic circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C385S016000, C385S024000, C385S039000, C528S042000

Reexamination Certificate

active

06787919

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The described invention relates to the field of opto-electronic circuits. In particular, the invention relates to an opto-electronic circuit that is coupled to a package substrate via solder bump technology.
2. Description of Related Art
Optical circuits include, but are not limited to, light sources, detectors and/or waveguides that provide such functions as multiplexing, demultiplexing and/or switching. Planar lightwave circuits (PLCS) are optical circuits that are manufactured and operate in the plane of the circuit. PLC technology is advantageous because it can be used to form small-scale components, such as array waveguide grating (AWG) filters, optical add/drop (de)multiplexers, optical switches, monolithic, as well as hybrid opto-electronic integration devices. Such devices formed with optical fibers would typically be much larger. Further, PLC structures may be batch fabricated on a silicon wafer.
An opto-electronic device circuit combines both electrical and optical functions. One type of opto-electronic circuit is a thermo-optic switch (TOS) made of a Mach-Zehnder interferometer. In a TOS, an optical signal is switched by providing an electrical input, i.e., an electrical current, to heat a heating element adjacent to an optical waveguide made of material, such as silica-on-silicon, that is sensitive to temperature. Heating the temperature-sensitive optical waveguide changes the refractive index and controls the path length of the optical waveguide, which results in the optical signal switching its optical path in the TOS, as is well-known. Various types of thermo-optic switches have been commercialized, such as 1×1, 1×2, 2×2, 4×4, 8×5 and 8-arrayed 2×2 varieties.
An opto-electronic device, such as a thermo-optic switch is typically coupled to an external electrical power supply by wire bonding from the power supply to the heating element of the thermo-optic switch.


REFERENCES:
patent: 5416872 (1995-05-01), Sizer, II et al.
patent: 5940548 (1999-08-01), Yamada et al.
patent: 6084050 (2000-07-01), Ooba et al.
patent: 6236774 (2001-05-01), Lackritz et al.
patent: 6384473 (2002-05-01), Peterson et al.
patent: 6463186 (2002-10-01), Li
patent: 6546173 (2003-04-01), Case et al.
patent: 6656528 (2003-12-01), Ouellet et al.
patent: 6658174 (2003-12-01), Doerr
patent: 196 43 911 (1998-05-01), None
patent: 1 094 355 (2001-04-01), None
patent: 05264831 (1993-10-01), None
T. Hayashi & k. Katsura, “New Hybrid Integrated Laser Diode-Drivers Using Microsolder Bump Bonding: SPICE Simulation of High-Speed Moduation Characteristics,” IEEE, Nov. 1, 1994, vol. 12, No. 11, XP: 000485314, pp. 1963-1970, New York, USA.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Flip-chip opto-electronic circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flip-chip opto-electronic circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip-chip opto-electronic circuit will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3264788

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.