Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2001-12-27
2004-09-07
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C385S016000, C385S024000, C385S039000, C528S042000
Reexamination Certificate
active
06787919
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The described invention relates to the field of opto-electronic circuits. In particular, the invention relates to an opto-electronic circuit that is coupled to a package substrate via solder bump technology.
2. Description of Related Art
Optical circuits include, but are not limited to, light sources, detectors and/or waveguides that provide such functions as multiplexing, demultiplexing and/or switching. Planar lightwave circuits (PLCS) are optical circuits that are manufactured and operate in the plane of the circuit. PLC technology is advantageous because it can be used to form small-scale components, such as array waveguide grating (AWG) filters, optical add/drop (de)multiplexers, optical switches, monolithic, as well as hybrid opto-electronic integration devices. Such devices formed with optical fibers would typically be much larger. Further, PLC structures may be batch fabricated on a silicon wafer.
An opto-electronic device circuit combines both electrical and optical functions. One type of opto-electronic circuit is a thermo-optic switch (TOS) made of a Mach-Zehnder interferometer. In a TOS, an optical signal is switched by providing an electrical input, i.e., an electrical current, to heat a heating element adjacent to an optical waveguide made of material, such as silica-on-silicon, that is sensitive to temperature. Heating the temperature-sensitive optical waveguide changes the refractive index and controls the path length of the optical waveguide, which results in the optical signal switching its optical path in the TOS, as is well-known. Various types of thermo-optic switches have been commercialized, such as 1×1, 1×2, 2×2, 4×4, 8×5 and 8-arrayed 2×2 varieties.
An opto-electronic device, such as a thermo-optic switch is typically coupled to an external electrical power supply by wire bonding from the power supply to the heating element of the thermo-optic switch.
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T. Hayashi & k. Katsura, “New Hybrid Integrated Laser Diode-Drivers Using Microsolder Bump Bonding: SPICE Simulation of High-Speed Moduation Characteristics,” IEEE, Nov. 1, 1994, vol. 12, No. 11, XP: 000485314, pp. 1963-1970, New York, USA.
Intel Corporation
Reif Kevin A.
Tran Mai-Huong
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