Flip-chip on leads devices

Details Flip-chip on leads devices Flip-chip on leads devices

1997-09-30

2000-05-09

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257735, 257786, H01L 23495

Patent

active

060607696

ABSTRACT:
A semiconductor die assembly and methods of forming same comprising a lead frame having a plurality of lead fingers and a semiconductor die having a plurality of electric contact points on an active surface of said semiconductor die. The electric contact points are located or rerouted on the semiconductor die active surface so as to maximize the size and spacing of electric contact points relative to the lead fingers, which may be custom-configured to match the "open" array of contact points and widened to enhance surface area for connection thereto. This arrangement results in large and robust flip-chip type interconnections between the electric contact points and the lead frame, eliminating the need for wirebonding and for adhesive connections of the lead frame to the die active surface.

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