Flip-chip nitride light emitting device and method of...

Details Flip-chip nitride light emitting device and method of... Flip-chip nitride light emitting device and method of...

2007-01-26

2009-02-17

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Compound semiconductor

C257SE21006

Reexamination Certificate

active

07491564

ABSTRACT:
A flip-chip light emitting device and a method of manufacturing thereof are provided. The flip-chip nitride light emitting device includes a substrate, an n type clad layer, an active layer, a p type clad layer, a multi ohmic contact layer, and a reflective layer, which are stacked in this order, wherein the multi ohmic contact layer is obtained by repeatedly stacking at least one stack unit of a reforming metal layer and a transparent conductive thin film, and wherein the reforming metal layer mainly contains silver (Ag). According to the flip-chip light emitting device and the method of manufacturing thereof, since the ohmic contact characteristics associated with a p type clad layer can be improved, it is possible to increase wire bonding efficiency and yield in a packaging process. In addition, since a low non-contact resistance and a good current-voltage characteristic can be obtained, it is possible to improve light emitting efficiency and to expand life time of the flip-chip light emitting device.

REFERENCES:
patent: 6989598 (2006-01-01), Song et al.
patent: 2002/0171087 (2002-11-01), Krames et al.
patent: 2004/0201110 (2004-10-01), Venugopalan et al.
patent: 2005/0087884 (2005-04-01), Stokes et al.
patent: 2005/0121685 (2005-06-01), Seong et al.
patent: 2000-164928 (2000-06-01), None
patent: 2002-151739 (2002-05-01), None
Korean Office Action dated Oct. 27, 2005.

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