Flip-chip mounting substrate and flip-chip mounting method

Details Flip-chip mounting substrate and flip-chip mounting method Flip-chip mounting substrate and flip-chip mounting method

2006-12-20

2010-12-07

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C438S106000, C438S107000, C438S108000, C438S118000, C438S119000, C257SE21511

Reexamination Certificate

active

07847417

ABSTRACT:
A solder resist and a central pad to which a central Au bump provided on a semiconductor chip is flip-chip bonded are formed on a substrate main body. In a flip-chip mounting substrate where an underfill resin is provided after the semiconductor chip is mounted, a central opening portion for exposing the central pad is formed in the solder resist, and also, an edge portion forming the central opening portion of the solder resist is partially overlapped with the outer peripheral portion of the central pad.

REFERENCES:
patent: 5889326 (1999-03-01), Tanaka
patent: 7112524 (2006-09-01), Hsu et al.
patent: 7420282 (2008-09-01), Iwane et al.
patent: 2005/0006789 (2005-01-01), Tomono et al.
patent: 2006/0065978 (2006-03-01), Nishiyama et al.
patent: 2006/0081999 (2006-04-01), Iwane et al.
patent: 2001-332584 (2001-11-01), None
patent: 2001332584 (2001-11-01), None

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