Flip chip mounted to thermal sensing element through the...

Details Flip chip mounted to thermal sensing element through the... Flip chip mounted to thermal sensing element through the...

2007-04-17

2007-04-17

Nguyen, Tuan H. (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S720000

Reexamination Certificate

active

10740239

ABSTRACT:
A method for providing cooled flip chip is provided. Solder paste is placed on a back side of a flip chip. A heat sink is placed against the solder paste. The solder paste is reflowed. In addition, an apparatus is provided. Generally, a zener diode flip chip with an active side and a back side opposite the active side and a positive thermal coefficient resistor are provided. A thermally conductive connection is between the positive thermal coefficient resistor and the back side of the zener diode flip chip.

REFERENCES:
patent: 4459632 (1984-07-01), Nijman et al.
patent: 4649333 (1987-03-01), Moore
patent: 4780598 (1988-10-01), Fahey et al.
patent: 5488254 (1996-01-01), Nishimura et al.
patent: 5533256 (1996-07-01), Call et al.
patent: 5587882 (1996-12-01), Patel
patent: 5644461 (1997-07-01), Miller et al.
patent: 5796160 (1998-08-01), Kozono
patent: 5811876 (1998-09-01), Haga et al.
patent: 6002239 (1999-12-01), Maloizel
patent: 6255141 (2001-07-01), Singh et al.
patent: 6331764 (2001-12-01), Oglesbee et al.
patent: 6489879 (2002-12-01), Singh et al.
patent: 6519154 (2003-02-01), Chiu
patent: 6770513 (2004-08-01), Vikram et al.
patent: 2001/0015477 (2001-08-01), Singh et al.
patent: 2002/0130398 (2002-09-01), Huang
patent: 2002/0145194 (2002-10-01), O'Connor et al.
U.S. Appl. No. 10/010,029, filed Dec. 5, 2001.

Affiliated with

Also associated with

Rating

Flip chip mounted to thermal sensing element through the... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flip chip mounted to thermal sensing element through the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip chip mounted to thermal sensing element through the... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3740626