Flip-chip mounted integrated circuit card element

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

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Details

C257S684000, C257S737000, C257S787000, C438S112000, C438S124000, C438S127000, C361S728000, C361S737000

Reexamination Certificate

active

07026720

ABSTRACT:
The invention relates to an integrated circuit card element, comprising a support (1) on which an electrical circuit (2) is produced, an integrated circuit (5) being connected thereto and having an active flip-chip mounted surface (7), said integrated circuit (5) being fixed to the support by a sealing product (6) that is arranged between the active surface of the integrated circuit and the support. The inventive element comprises a reinforcement segment (8) which is fixed on an inactive surface (9) of the integrated circuit opposite the active surface (7).

REFERENCES:
patent: 5528222 (1996-06-01), Moskowitz et al.
patent: 5682296 (1997-10-01), Horejs, Jr. et al.
patent: 6111303 (2000-08-01), Launay
patent: 6435415 (2002-08-01), Catte

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