Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2006-04-11
2006-04-11
Kang, Donghee (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S684000, C257S737000, C257S787000, C438S112000, C438S124000, C438S127000, C361S728000, C361S737000
Reexamination Certificate
active
07026720
ABSTRACT:
The invention relates to an integrated circuit card element, comprising a support (1) on which an electrical circuit (2) is produced, an integrated circuit (5) being connected thereto and having an active flip-chip mounted surface (7), said integrated circuit (5) being fixed to the support by a sealing product (6) that is arranged between the active surface of the integrated circuit and the support. The inventive element comprises a reinforcement segment (8) which is fixed on an inactive surface (9) of the integrated circuit opposite the active surface (7).
REFERENCES:
patent: 5528222 (1996-06-01), Moskowitz et al.
patent: 5682296 (1997-10-01), Horejs, Jr. et al.
patent: 6111303 (2000-08-01), Launay
patent: 6435415 (2002-08-01), Catte
Girard Sophie
Provost Stephane
Anderson & Jansson
Jansson Pehr
Kang Donghee
Schlumberger Inc.
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